MILLICE(IMAGETRANSFORMS)

1、True Clean

• A new choice for chip dicing process

• Increase the lifespan of the blade by over 50%

• Environmentally degradable formula, compliant with more advanced environmental regulations

• Manufactured in China, providing faster service to customers and meeting domestic demand

2、HISPEC Injector Systems

• Accommodates up to 4 high quality metering surfactant pumps

• The integrated PLC supports flexible programming to customize system settings, offering enhanced control and adaptability.

• Automated dosing directly from surfactant canister

• Monitor and control surfactant dosing via touch screen interface

• Integrates seamlessly into a variety of wafer dicing saws 

• Multiple automated warning systems minimize downtime

• Equipped with durable wheels, the HiSpec XI is easy to move and reposition within your facility.

3、iCoat 激光保护液

• Water-soluble protective film

• Effectively capture debris and particles generated during the laser cutting process

• Protect sensitive circuits and bonding pads from contamination and oxidation

• Can be completely cleaned and removed using deionized（DI）water

• Shipment in 5, 10, 20-liter containers

4、DXB Wafer Bonder

• with Active Cooling

• Suitable for laboratories and research institude

• Pressure，temperature and Vacuum adjustable

• Suitable to several materials (Si, III-VI, Glass …)