Scia systems
Solutions for thin film technology
The German company scia Systems manufactures advanced ion beam and plasma processing systems for the production of microelectronics, MEMS and precision optical components. scia Systems uniquely integrates advanced source technologies with innovative sample movement for localized rate and process control. The employees of scia Systems combine years of expertise in manufacturing of complex vacuum process equipment with special technology know-how.
As a majority-owned affiliate of VON ARDENNE, the well-known supplier of vacuum technology from Dresden, scia Systems is able to focus on technology and applications while enjoying strong financial and organizational support.
Technology Portfolio
Ion Beam Etching and Milling (IBE/IBM)
The scia Mill 150 is designed for Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Additionally the system can be applied for Reactive Ion Beam Etching (RIBE) as well as for Chemically Assisted Ion Beam Etching (CAIBE).
Typical applications are the structuring of metal films for MEMS and sensors, usually in the field of research & development and low volume production.
Ion Beam Trimming (IBT)
The scia Trim 200 is designed for high precision trimming in wafer processing.
TTypical applications of the system are frequency and thickness trimming in manufacturing of bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.
The scia Trim 200 is a high volume production system with a standard semiconductor cassette handling robot.
In addition scia Systems offers process systems for Dual Ion Beam Deposition (DIBD)
